Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw
Provide process engineering support on the following Backend2 process: (1) Wafer Backgrind (2) Laser Mark (3) Wafer Saw and process operational…
Singapore
STATS ChipPAC provides semiconductor packaging and technology solutions.
Provide process engineering support on the following Backend2 process: (1) Wafer Backgrind (2) Laser Mark (3) Wafer Saw and process operational…